Short Interest in Nitto Denko Corp. (OTCMKTS:NDEKY) Drops By 75.1%

Nitto Denko Corp. (OTCMKTS:NDEKY) was the target of a large decrease in short interest during the month of May. As of May 15th, there was short interest totaling 3,644 shares, a decrease of 75.1% from the April 30th total of 14,630 shares. Based on an average daily trading volume, of 416,040 shares, the short-interest ratio is currently 0.0 days. Currently, 0.0% of the shares of the company are sold short.

Nitto Denko Trading Down 5.1%

Shares of OTCMKTS:NDEKY traded down $1.01 during trading on Friday, reaching $18.73. 61,432 shares of the stock were exchanged, compared to its average volume of 135,816. Nitto Denko has a 12 month low of $16.43 and a 12 month high of $26.48. The firm has a market cap of $12.71 billion, a PE ratio of 14.30 and a beta of 0.87. The stock has a 50-day moving average price of $19.77 and a 200-day moving average price of $22.09.

Nitto Denko (OTCMKTS:NDEKY) last issued its quarterly earnings data on Monday, April 27th. The technology company reported $0.26 earnings per share (EPS) for the quarter, missing analysts’ consensus estimates of $0.29 by ($0.03). The firm had revenue of $1.52 billion for the quarter, compared to the consensus estimate of $1.54 billion. Nitto Denko had a return on equity of 12.47% and a net margin of 13.00%.Nitto Denko has set its FY 2026 guidance at 1.330-1.330 EPS.

Nitto Denko Company Profile

Nitto Denko Corporation, trading over?the?counter in the U.S. under the symbol NDEKY, is a Japan?based manufacturer specializing in advanced materials and components. The company’s core offerings include pressure-sensitive adhesive tapes, optical films, and functional polymers used across a broad spectrum of industries. With a focus on innovation, Nitto Denko develops solutions for electronics, automotive, and healthcare markets, leveraging proprietary coating, lamination and microfabrication technologies.

The company’s product portfolio spans display materials—such as polarizing films for LCD panels—semiconductor device protection tapes, thermal interface materials for heat dissipation, and a range of industrial adhesive products.