Disco Corp (OTCMKTS:DSCSY – Get Free Report) was the recipient of a significant increase in short interest during the month of August. As of August 31st, there was short interest totaling 46,196 shares, an increase of 203.0% from the August 15th total of 15,246 shares. Currently, 0.0% of the company’s shares are sold short. Based on an average daily trading volume, of 311,923 shares, the short-interest ratio is presently 0.1 days.
Disco Stock Performance
OTCMKTS DSCSY traded up $0.54 on Friday, reaching $34.34. The company had a trading volume of 164,405 shares, compared to its average volume of 196,322. The firm has a market capitalization of $37.26 billion, a price-to-earnings ratio of 39.47 and a beta of 1.54. Disco has a 1-year low of $26.33 and a 1-year high of $58.00. The company’s fifty day moving average is $38.67 and its 200-day moving average is $42.99.
Disco (OTCMKTS:DSCSY – Get Free Report) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The company had revenue of $717.28 million during the quarter. On average, research analysts forecast that Disco will post 1.11 earnings per share for the current year.
Wall Street Analysts Forecast Growth
Check Out Our Latest Report on Disco
Institutional Trading of Disco
A hedge fund recently bought a new position in Disco stock. Azimuth Capital Investment Management LLC bought a new position in shares of Disco Corp (OTCMKTS:DSCSY – Free Report) in the 2nd quarter, according to the company in its most recent 13F filing with the Securities & Exchange Commission. The institutional investor bought 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is currently owned by hedge funds and other institutional investors.
About Disco
DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.
Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.
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