Disco (OTCMKTS:DSCSY) Shares Up 4.8% – Still a Buy?

Shares of Disco Corp (OTCMKTS:DSCSYGet Free Report) shot up 4.8% during trading on Wednesday . The stock traded as high as $44.35 and last traded at $43.04. 9,175 shares changed hands during trading, a decline of 97% from the average session volume of 286,670 shares. The stock had previously closed at $41.07.

Wall Street Analyst Weigh In

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company. According to MarketBeat.com, the stock presently has a consensus rating of “Buy”.

Read Our Latest Stock Report on DSCSY

Disco Stock Up 4.7%

The company’s 50-day moving average price is $43.59 and its 200-day moving average price is $39.84. The firm has a market cap of $46.66 billion, a price-to-earnings ratio of 52.45 and a beta of 1.54.

Disco (OTCMKTS:DSCSYGet Free Report) last announced its earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The business had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Analysts predict that Disco Corp will post 1.07 earnings per share for the current fiscal year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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