Disco (OTCMKTS:DSCSY) Shares Down 4.4% – Time to Sell?

Disco Corp (OTCMKTS:DSCSYGet Free Report)’s share price was down 4.4% on Wednesday . The stock traded as low as $28.50 and last traded at $29.25. Approximately 877,531 shares were traded during mid-day trading, an increase of 425% from the average daily volume of 167,292 shares. The stock had previously closed at $30.61.

Wall Street Analysts Forecast Growth

Separately, Zacks Research raised Disco from a “strong sell” rating to a “hold” rating in a report on Tuesday, November 11th. One analyst has rated the stock with a Strong Buy rating and two have assigned a Hold rating to the company. According to data from MarketBeat.com, Disco presently has an average rating of “Moderate Buy”.

View Our Latest Analysis on Disco

Disco Stock Performance

The company has a 50 day simple moving average of $31.48 and a 200 day simple moving average of $29.41. The company has a market capitalization of $31.42 billion, a PE ratio of 37.62 and a beta of 1.55.

Disco (OTCMKTS:DSCSYGet Free Report) last issued its quarterly earnings results on Wednesday, October 29th. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a return on equity of 26.06% and a net margin of 30.85%.The firm had revenue of $709.55 million for the quarter. As a group, equities research analysts anticipate that Disco Corp will post 0.7 EPS for the current year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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