Disco Corp (OTCMKTS:DSCSY) Short Interest Update

Disco Corp (OTCMKTS:DSCSY) was the target of a large growth in short interest in June. As of June 30th, there was short interest totaling 115,925 shares, a growth of 486.9% from the June 15th total of 19,753 shares. Based on an average daily volume of 782,291 shares, the short-interest ratio is presently 0.1 days. Approximately 0.0% of the company’s stock are short sold.

Wall Street Analyst Weigh In

Separately, Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, Based on data from MarketBeat, Disco has a consensus rating of “Hold”.

Disco Trading Down 3.8%

Shares of OTCMKTS:DSCSY traded down $1.72 during midday trading on Monday, reaching $43.70. The company had a trading volume of 49,903 shares, compared to its average volume of 295,546. The stock has a market cap of $47.41 billion, a P/E ratio of 53.29 and a beta of 1.50. The company’s 50 day moving average price is $46.19 and its 200 day moving average price is $43.61. Disco has a 52-week low of $24.94 and a 52-week high of $58.00.

Disco (OTCMKTS:DSCSY) last announced its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The business had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Research analysts forecast that Disco will post 1.05 EPS for the current fiscal year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.