Disco Corp (OTCMKTS:DSCSY) Short Interest Down 86.6% in April

Disco Corp (OTCMKTS:DSCSY) was the target of a large decrease in short interest in April. As of April 30th, there was short interest totaling 19,942 shares, a decrease of 86.6% from the April 15th total of 149,045 shares. Based on an average daily trading volume, of 202,001 shares, the short-interest ratio is presently 0.1 days. Approximately 0.0% of the shares of the stock are short sold.

Wall Street Analysts Forecast Growth

Separately, Zacks Research raised Disco from a “hold” rating to a “strong-buy” rating in a report on Monday, April 20th. Two research analysts have rated the stock with a Strong Buy rating, Based on data from MarketBeat.com, Disco presently has a consensus rating of “Strong Buy”.

Disco Trading Down 3.8%

OTCMKTS DSCSY traded down $1.79 during trading hours on Thursday, reaching $44.77. 285,738 shares of the company’s stock were exchanged, compared to its average volume of 293,103. The stock has a market cap of $48.57 billion, a PE ratio of 54.60 and a beta of 1.63. Disco has a one year low of $22.08 and a one year high of $52.99. The firm has a fifty day moving average of $44.32 and a 200-day moving average of $39.11.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. The business had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. Disco had a return on equity of 26.03% and a net margin of 30.95%. As a group, research analysts forecast that Disco will post 1.07 EPS for the current year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.