Disco Corp (OTCMKTS:DSCSY) Sees Large Drop in Short Interest

Disco Corp (OTCMKTS:DSCSY) saw a significant decline in short interest in May. As of May 29th, there was short interest totaling 15,431 shares, a decline of 90.9% from the May 14th total of 168,911 shares. Currently, 0.0% of the shares of the stock are short sold. Based on an average daily trading volume, of 522,973 shares, the short-interest ratio is currently 0.0 days.

Wall Street Analyst Weigh In

Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One investment analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. According to MarketBeat, the stock presently has an average rating of “Buy”.

Disco Stock Up 0.9%

OTCMKTS DSCSY traded up $0.40 during trading hours on Tuesday, hitting $44.34. 193,846 shares of the company were exchanged, compared to its average volume of 199,254. The stock has a market cap of $48.10 billion, a PE ratio of 54.07 and a beta of 1.54. The stock has a 50-day moving average price of $43.80 and a 200 day moving average price of $40.41. Disco has a 52 week low of $22.92 and a 52 week high of $52.99.

Disco (OTCMKTS:DSCSY) last released its earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. The firm had revenue of $848.13 million for the quarter, compared to analysts’ expectations of $771.53 million. Disco had a return on equity of 25.27% and a net margin of 30.95%. As a group, sell-side analysts anticipate that Disco will post 1.07 earnings per share for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.