Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped down prior to trading on Monday . The stock had previously closed at $218.83, but opened at $201.51. BE Semiconductor Industries shares last traded at $201.7887, with a volume of 820 shares.
Wall Street Analysts Forecast Growth
Several research firms have commented on BESIY. Berenberg Bank raised shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research note on Tuesday, August 4th. Zacks Research raised shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research note on Wednesday, July 29th. Finally, Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, September 8th. Two analysts have rated the stock with a Strong Buy rating, five have assigned a Buy rating and two have issued a Hold rating to the company. Based on data from MarketBeat.com, the stock has an average rating of “Buy”.
Check Out Our Latest Stock Analysis on BESIY
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its earnings results on Thursday, July 23rd. The technology company reported $1.29 EPS for the quarter, missing the consensus estimate of $1.30 by ($0.01). The business had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. BE Semiconductor Industries had a net margin of 28.42% and a return on equity of 46.44%. On average, equities research analysts forecast that BE Semiconductor Industries NV will post 4.83 earnings per share for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (BESI) is a Netherlands-based semiconductor equipment manufacturer that develops, produces and markets systems used in the assembly and packaging of semiconductor devices. Its equipment is used by semiconductor manufacturers and outsourced semiconductor assembly and test providers to connect, protect and package semiconductor components after wafer fabrication.
The company’s product portfolio includes die-attach systems, packaging equipment and related solutions for advanced semiconductor applications.
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