BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) hit a new 52-week high during trading on Monday . The stock traded as high as $374.33 and last traded at $370.2150, with a volume of 799 shares traded. The stock had previously closed at $352.92.
Analyst Ratings Changes
BESIY has been the subject of a number of research analyst reports. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Zacks Research upgraded BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. Finally, Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating, five have given a Buy rating and four have issued a Hold rating to the company’s stock. Based on data from MarketBeat, BE Semiconductor Industries presently has an average rating of “Moderate Buy”.
Check Out Our Latest Research Report on BESIY
BE Semiconductor Industries Stock Down 7.5%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, meeting analysts’ consensus estimates of $0.76. The business had revenue of $216.51 million for the quarter, compared to analysts’ expectations of $220.77 million. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. As a group, equities research analysts predict that BE Semiconductor Industries NV will post 4.45 earnings per share for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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