Disco (OTCMKTS:DSCSY) Shares Gap Down – What’s Next?

Disco Corp (OTCMKTS:DSCSY)’s stock price gapped down before the market opened on Wednesday . The stock had previously closed at $41.10, but opened at $39.00. Disco shares last traded at $38.57, with a volume of 4,203 shares traded.

Wall Street Analyst Weigh In

DSCSY has been the subject of several recent research reports. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a research report on Monday, July 27th. Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Buy rating and one has issued a Hold rating to the company’s stock. According to MarketBeat.com, Disco currently has an average rating of “Moderate Buy”.

Disco Trading Up 0.6%

The business has a 50 day simple moving average of $43.72 and a two-hundred day simple moving average of $44.21. The company has a market cap of $41.09 billion, a PE ratio of 43.53 and a beta of 1.55.

Disco (OTCMKTS:DSCSY) last released its earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. The business had revenue of $717.28 million for the quarter. On average, equities research analysts expect that Disco Corp will post 1.05 earnings per share for the current fiscal year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.