Short Interest in Disco Corp (OTCMKTS:DSCSY) Decreases By 90.9%

Disco Corp (OTCMKTS:DSCSY) was the recipient of a significant decline in short interest in July. As of July 15th, there was short interest totaling 10,600 shares, a decline of 90.9% from the June 30th total of 115,925 shares. Based on an average trading volume of 720,554 shares, the short-interest ratio is currently 0.0 days. Currently, 0.0% of the company’s shares are sold short.

Disco Stock Performance

Disco stock traded down $2.38 during midday trading on Friday, hitting $36.37. 187,313 shares of the company’s stock were exchanged, compared to its average volume of 303,400. The company has a market cap of $39.46 billion, a PE ratio of 44.35 and a beta of 1.50. The firm has a 50-day moving average of $45.17 and a two-hundred day moving average of $44.31. Disco has a 12 month low of $24.94 and a 12 month high of $58.00.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The firm had revenue of $717.28 million for the quarter. As a group, equities analysts expect that Disco will post 1.05 earnings per share for the current year.

Wall Street Analyst Weigh In

Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Hold rating, According to data from MarketBeat.com, Disco currently has an average rating of “Hold”.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.