BE Semiconductor Industries (OTCMKTS:BESIY) Releases Earnings Results, Misses Estimates By $0.01 EPS

BE Semiconductor Industries (OTCMKTS:BESIY) announced its quarterly earnings results on Thursday. The technology company reported $1.29 earnings per share for the quarter, missing the consensus estimate of $1.30 by ($0.01), Zacks reports. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

BE Semiconductor Industries Stock Down 6.8%

Shares of BESIY traded down $19.21 during midday trading on Thursday, hitting $264.59. 1,478 shares of the company’s stock traded hands, compared to its average volume of 7,743. BE Semiconductor Industries has a 1 year low of $122.81 and a 1 year high of $374.33. The firm’s fifty day moving average is $316.28 and its 200-day moving average is $257.29. The company has a current ratio of 4.74, a quick ratio of 4.17 and a debt-to-equity ratio of 1.11. The stock has a market capitalization of $19.19 billion, a price-to-earnings ratio of 119.72 and a beta of 1.97.

Wall Street Analysts Forecast Growth

Several research analysts recently commented on the company. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Finally, Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, June 26th. Five equities research analysts have rated the stock with a Buy rating and four have issued a Hold rating to the company. According to data from MarketBeat.com, BE Semiconductor Industries presently has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.