Disco (OTCMKTS:DSCSY) Sees Unusually-High Trading Volume – Still a Buy?

Shares of Disco Corp (OTCMKTS:DSCSYGet Free Report) saw unusually-high trading volume on Friday . 329,944 shares were traded during mid-day trading, an increase of 16% from the previous session’s volume of 284,025 shares.The stock last traded at $47.91 and had previously closed at $49.14.

Wall Street Analyst Weigh In

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. Based on data from MarketBeat, the company presently has a consensus rating of “Buy”.

View Our Latest Stock Analysis on DSCSY

Disco Price Performance

The firm has a market capitalization of $52.85 billion, a PE ratio of 59.41 and a beta of 1.54. The firm has a fifty day moving average price of $46.08 and a 200 day moving average price of $42.32.

Disco (OTCMKTS:DSCSYGet Free Report) last issued its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. The firm had revenue of $848.13 million for the quarter, compared to analysts’ expectations of $771.53 million. Disco had a return on equity of 25.27% and a net margin of 30.95%. On average, sell-side analysts expect that Disco Corp will post 1.05 EPS for the current year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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