Oxford Instruments (LON:OXIG) Trading Down 0.7% – Time to Sell?

Shares of Oxford Instruments plc (LON:OXIG) traded down 0.7% on Thursday . The company traded as low as GBX 2,095 ($26.56) and last traded at GBX 2,120 ($26.87). 52,291 shares changed hands during trading, a decline of 49% from the average session volume of 103,452 shares. The stock had previously closed at GBX 2,135 ($27.06).

Analyst Ratings Changes

OXIG has been the topic of a number of research analyst reports. Shore Capital restated a “buy” rating on shares of Oxford Instruments in a research note on Wednesday, October 16th. Berenberg Bank dropped their price objective on shares of Oxford Instruments from GBX 2,925 ($37.08) to GBX 2,830 ($35.87) and set a “buy” rating on the stock in a research report on Tuesday, November 12th.

Oxford Instruments Stock Performance

The company has a market cap of £1.23 billion, a P/E ratio of 2,465.12, a price-to-earnings-growth ratio of -3.56 and a beta of 0.96. The stock has a 50 day moving average price of GBX 2,076.81 and a two-hundred day moving average price of GBX 2,266.18. The company has a quick ratio of 1.11, a current ratio of 1.64 and a debt-to-equity ratio of 12.96.

Oxford Instruments Cuts Dividend

The company also recently disclosed a dividend, which will be paid on Friday, January 10th. Shareholders of record on Thursday, November 28th will be given a dividend of GBX 5.10 ($0.06) per share. This represents a yield of 0.24%. The ex-dividend date is Thursday, November 28th. Oxford Instruments’s payout ratio is 2,441.86%.

Oxford Instruments Company Profile

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.