Shares of ChipMOS Technologies stock traded up $0.07 during midday trading on Monday, hitting $23.96. 13,155 shares of the company were exchanged, compared to its average volume of 18,530. The company has a debt-to-equity ratio of 0.49, a current ratio of 2.46 and a quick ratio of 2.11. The firm has a market cap of $1.04 billion, a P/E ratio of 10.38 and a beta of 0.55. ChipMOS Technologies has a 52 week low of $13.92 and a 52 week high of $24.83. The firm has a 50 day simple moving average of $21.12 and a 200-day simple moving average of $18.36.
Institutional investors have recently bought and sold shares of the stock. Foundry Partners LLC lifted its position in shares of ChipMOS Technologies by 8.0% during the 2nd quarter. Foundry Partners LLC now owns 212,882 shares of the semiconductor company’s stock worth $3,274,000 after buying an additional 15,706 shares during the period. Parallel Advisors LLC increased its holdings in ChipMOS Technologies by 5,803.6% during the 2nd quarter. Parallel Advisors LLC now owns 13,224 shares of the semiconductor company’s stock valued at $203,000 after purchasing an additional 13,000 shares in the last quarter. Atria Investments LLC acquired a new stake in ChipMOS Technologies during the 2nd quarter valued at $9,406,000. Renaissance Technologies LLC increased its holdings in ChipMOS Technologies by 1.7% during the 2nd quarter. Renaissance Technologies LLC now owns 1,487,676 shares of the semiconductor company’s stock valued at $22,880,000 after purchasing an additional 25,009 shares in the last quarter. Finally, Janney Montgomery Scott LLC acquired a new stake in ChipMOS Technologies during the 3rd quarter valued at $373,000. Institutional investors and hedge funds own 5.83% of the company’s stock.
About ChipMOS Technologies
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors.
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